SMT Packaging Technician / Engineer

Tinton Falls  - Permanent

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About Talenteeds

Leader using digital tools to streamline the recruitment on permanent contracts, Talenteeds has grown in step with its ambitions. We work with clients in Europe and North America who trust us to find them the candidates who will allow them to make a difference and to surround themselves with successful employees.


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About our client

Our client is close to his clients and collaborators.

It has always innovated to meet the growing challenges of a rapidly changing, powerful and diversified sector, with a range of professions, skills, and interpersonal skills for which our client supports his employees to make them evolve. and reveal new talents

Job description

As the Electronics Packaging Engineer or Technician, you will be responsible for the successful implementation of new SMT line processes as well as the continuous improvement of manufacturing efforts on the production floor.


This role develops, evaluates, and improves fabrication processes for new printed electronic and semiconductor packaging applications/products that meet customer requirements, including product performance, quality standards, cost and delivery. Very hands on role, spending over 80% of the time on the line running samples/developing processes.


Research and Development and Customer Application / Qualification

  • Create and execute new product development plans based on customer input and requirements
  • Work with internal team and customers on new product goals, prototyping and qualifications
  • Develop new processes & manufacturing techniques to support new SMT line and products
  • Industrialize prototype process in preparation for scale, qualifications / manufacturing

Process Improvement

  • Identify innovative and improved methods for existing product lines
  • Improve/qualify existing products, process techniques based on customer needs
  • Program/project manage customer or grant projects providing progress on timing and budget



Profile

  • B.S in Electrical Engineering or relevant working experience with emphasis on R&D, Design for Manufacturing and/or Custom Engineering associated with Electronics Packaging / Surface Mount Technology.
  • 5+ years’ experience working in a R&D/manufacturing setting related to electronics, flexible circuits, and/or conductive adhesives. Small business experience is preferred.
  • 5+ years’ experience with SMT processes
  • 2+ years’ experience with conductive adhesives is preferred.
  • 5+ year of process engineering and equipment troubleshooting experience with flex circuits, SMT
  • Experience working within requirements of ISO 9001 /ISO 13485 and ITAR
  • Tech savvy / Software skills: CAD (2D/3D), MS Office, Minitab/Analytical tools
  • Strong writing skills: internal and external project documentation, grant writing, patent writing.


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